TDK will be at Embedded World 2018 from February 27 to March 1 in Nuremberg, Germany, at booth 209 in hall 3A by its group companies TDK-Micronas, TDK-Lambda, TDK Europe, and InvenSense. For the first time, TDK is showing magnetic sensors and embedded motor control solutions as well as power supply solutions, SD and microSD memory cards and components for Internet-of-Things applications at a single booth.
Embedded motor control and magnetic sensors by TDK-Micronas
The HVC 4223F by TDK-Micronas enables the drive of a wide range of small brush-type, stepper, or brushless motors in the field of smart actuators. As a fully integrated single-chip solution including ARM® Cortex®-M3 CPU core, LIN 2.x communication interface, Automotive grade power supply, pre-driver stages, and six half-bridges, nearly no additional external components are required. By integrating the high-performance microcontroller core and combining all relevant motor control IPs, it gains flexibility and easy reusability in new applications, regardless of change of motor type or application concept.
Target applications are mainly automotive related – smart robotics, medical or related industrial and consumer applications will be served as well.
Furthermore, TDK-Micronas will show its extensive portfolio of magnetic field sensor solutions, based on the so-called Hall effect, for Automotive and Industrial applications.
Power supply solutions by TDK-Lambda
Utilizing DSP (Digital Signal Processing) technology, TDK-Lambda Genesys+™ series of high power density programmable DC power supplies provide improved efficiency, performance and functionality compared to existing products. The Genesys+™ series addresses a very broad market, including component, aerospace and automotive testing, semiconductor fabrication, water treatment, plating and solar array simulation. Housed in a 1 U high, 19” (483 mm) wide rack package, the 5 kW model offers the highest power density and, at less than 7.5 kg, lightest weight in the industry (less than half the weight of comparable products).
In addition, TDK-Lambda will present its 100W i3A series of non-isolated DC-DC converters, packaged in the industry standard 1/32nd brick form factor. These step-down converters are capable of adjustment from either 3.3 to 16.5 V or 5 to 30 V output and accept an input voltage of 9 to 53 V.
SD Memory cards and electronic components by TDK Europe
TDK Europe will present the recent additions to its SD Memory cards and microSD memory cards portfolio, suitable for industrial applications.
The MMRD4 and MURD4 series consist of highly reliable SD/microSD memory cards equipped with very durable SLC/pSLC flash memory as well as the newly developed SD controller, TDK GBDriverRD4. In addition to data retention capacity and durability, the cards feature robust data security in the event of power interruption, ensuring safe usage in IoT devices that are often turned off to conserve power. Both series support UHS-I for industrial application. The new products also have a data security function, with the option for TDK’s original authentication function, in addition to the SD standard compliant password lock. They also provide great security against falsification and leakage of data stored on a NAND-type flash memory.
Moreover, TDK Europe will give an overview of its product range of TDK and EPCOS components for Internet-of-Things applications. This will include RF components, Multilayer and Thin-film inductors, ceramic capacitors, SESUB modules, piezo actuators with haptic feedback and wireless charging coils.
Motion and sound sensor solutions by InvenSense
InvenSense’s solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, and microphones with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. InvenSense’s motion tracking, audio and location platforms, and services can be found in mobile, wearables, smart home, industrial, automotive, and IoT products. At Embedded World, InvenSense will showcase new capacitive pressure sensor solutions, analog and digital MEMS microphone solutions, and 6-axis (gyroscope and accelerometer) technologies.