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Power Stamp Alliance formed to create ecosystem for open compute and data center projects

At the Open Compute U.S. Summit 2018 today, four leading suppliers of power solutions announced a new alliance, the Power Stamp Alliance, to create collaborative solutions for 48V-to-low-voltage on-board DC-DC power converters. These 48V direct conversion DC-DC modules – or ‘power stamps’ – primarily target high-performance computers and servers being used in large data centers, many of which follow the principles of the Open Compute Project (OCP).

By creating and sharing a specification for a standard product footprint and functions, the Power Stamp Alliance has created a multivendor ecosystem to assure practical levels of alternate source capability to server and storage system manufacturers, while encouraging a competitive supply chain through differentiation in topology, circuitry, and performance from multiple, independent manufacturers.

The first processor architectures addressed by the Power Stamp Alliance include the Intel VR13 Skylake
CPUs, Intel VR13-HC Ice Lake CPUs, DDR4 memories, IBM POWER9 (P9) processors and high-current ASIC
and/or FPGA chipsets supporting the SVID or AVS protocols. The electrical concept of power stamps uses the
principle of a discrete or main stamp unit controlling up to five satellite stamp units that combine to
achieve more than 600 amps in total current capability. The size and powertrain footprint of the main
and satellite power stamps are the same,simplifying the design process for OEMs. As the power demands of
processor and memory devices increases, the PSA specification provides a scalable solution that can be
used in tandem with existing power-conversion devices.

For more information visit www.powerstamp.org/specifications

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