Littelfuse announces a series of fifteen-minute “TechTalks LIVE!” to be presented in their booth (Hall 7, Booth 335) during PCIM (Power Conversion and Intelligent Motion) Europe 2017. At the conclusion of each TechTalk session, visitors are encouraged to ask questions of the Littelfuse subject matter experts.
“TechTalks LIVE!” will address a variety of issues related to power semiconductors, particularly the challenges associated with integrating silicon carbide (SiC) devices like Schottky diodes and MOSFETs into power converter designs.
Three in-booth TechTalks are planned for each day of the exhibition, from Tuesday, May 16 through Thursday, May 18:
10:00 am: “Accelerate Your Next Power Converter Design with SiC: Gate Drive and Converter Layout Considerations”
The fast switching speed of SiC MOSFETs brings the opportunity for high efficiency, high power density power converter design. It also presents the challenge of higher dv/dt, di/dt, which induces severe EMI issues in the circuit design and stricter requirements for protection circuits. The driving and power circuits must be designed carefully to handle the challenges associated with SiC MOSFETs’ high-speed switching.
Noon: “DC Performance of PSR Series SiC Schottky Diodes and Their Use in Designing Energy Storage Systems”
Harnessing the full potential of the renewable energy generation depends upon the efficiency of energy storage systems like batteries. Consequently, batteries and their associated power conversion systems must be protected from high DC overcurrent fault conditions. High-speed fuses with increased DC voltage and interrupt rating performance are critical for protecting these systems.
2:00 pm: “Knowing When to Switch to SiC”
Although the use of SiC is increasingly popular, silicon still offers many advantages, including lower cost, greater process maturity, and a wider range of product offerings. This talk offers insights to help circuit designers determine whether to switch to SiC devices or continue using silicon devices for their applications.
The Littelfuse booth activities are organized under the theme “Speed. Agility. Flexibility. The Future of Power Semiconductor. Today.” In addition to the TechTalks, booth visitors can see several new SiC devices and other products related to power semiconductors:
- GEN2 Series SiC Schottky Diodes are the first of a line of products based on the technology platform created through the partnership formed by Littelfuse and Monolith Semiconductor. Compared to standard silicon bipolar power diodes, they allow circuit designers to dramatically reduce switching losses and enable substantial increases in the efficiency and robustness of power electronics systems.
- Booth visitors will get an advanced look at the forthcoming line of 1200 V SiC MOSFETs, which are being manufactured in an automotive-qualified 150mm CMOS foundry.
- POWR-SPEED® PSR Series High-Speed Square Body Fuses are designed specifically to protect power semiconductor devices such as diodes, triacs, SCRs, MOSFETs, IGBT-based applications and other solid-state devices that are typically designed into power conversion and power conditioning equipment.