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Infineon’s Double DPAK top-side cooled solution targets high-power apps

Increasing complexity of end products is challenging the design parameters for high power supplies: these require higher power and more efficiency in an even smaller space. Semiconductor devices are essential to the operation and performance of modern switched mode power supplies (SMPS). Over the last years, a trend towards surface mount devices (SMD) has been emerging. Thermal management of the present-day SMD-based SMPS designs still remains a barrier to efficiency. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) offers Double DPAK (DDPAK), the first top-side cooled SMD package, addressing high power applications such as server, telecom, solar and high-end PC power. This new packaging solution enables fast switching and high efficiency in reduced size and weight with a minimized total cost of ownership.

The innovative top-side cooled package exceeds the industry’s quality requirements. Thanks to the innovative top-side cooling concept, it further shapes the high power SMPS market. The features of DDPAK get combined with the benefits of the already existing high voltage technologies of 600V CoolMOS™ G7 SJ MOSFET and CoolSiC™ Schottky Diode 650V G6. The thermal decoupling of the printed circuit board and semiconductor enables higher power density or longer system lifetime.

DDPAK offers industry-leading performance as an SMD alternative for high power SMPS designs. Its four-pin configuration allows for separate pin source-sense to deliver undisturbed signal to the driver. Thus, it provides higher efficiency at full load.

For more information visit www.infineon.com/smd-topsidecooling

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