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Infineon to exhibit power solutions for rugged applications at ECCE 2017

From October 1 to October 5, the world’s leading technical conference and exposition for energy conversion solutions, IEEE Energy Conversion Congress & Expo (ECCE) will take place in Cincinnati, Ohio.

Infineon will be at booth 220 where their engineering experts will demonstrate innovative high power density enabling product-to-system solutions for all types of industrial applications, including Uninterruptable Power Supplies (UPS), CAV, industrial automation and motor control. Our technical sales team will be on hand to discuss your latest power design requirements with you. Get a motor running within one hour with our new iMOTION Modular Application Design Kit (MADK). It features a range of modular control and power boards to set up a complete motor system along with the appropriate PC software.

Thermal Interface Material (TIM), now available with the majority of Infineon power modules, simplifies the manufacturing process and achieves the highest thermal conductivity along with unparalleled reliability. EconoDUAL™ 3 and Econo 2 / Econo 3 modules with integrated shunt resistors for current measurement enable a compact inverter design to meet the need for highest power density and lower system costs. PrimePACK with IGBT5 and .XT increases power density by 25% or prolongs lifetime by a factor of 10 is now available with TIM. Solder Bond Modules: Predictably high performance and lifetime due to 100% x-ray monitoring. The Rectifier Diode Modules (DD) in 34 and 50 mm housings are now available in 1800 V, 2000 V and 2200 V for high production volumes. Infineon Power Start Modules for soft starters up to 300 kW: Specially designed to lower cost by 20%, reduce complexity (one fits all) and shrink footprint by 20%.

Infineon’s leading-edge technologies offer efficiency and reliability for solar applications. Highlights include CoolSiC MOSFETs, Trench + Fieldstop IGBTs and coreless transformer drivers. TRENCHSTOP 5 IGBT technology redefines the concept of ”best-in-class” by providing unmatched efficiency levels. The modules and stacks are designed to deliver the highest reliability and efficiency performance. Full SiC and hybrid Easy modules with SiC MOSFETs and diodes offer best-in-class power densities up to 100 kHz switching frequency in booster as well as in 2-level and 3-level inverter topologies. Our PrimePACK family with IGBT5 and .XT sets a new benchmark for reliability, power density and efficiency in central inverter applications, also meeting new trends like 1500 V input voltage.

Traction is among the most demanding applications for power electronic modules. Climatic influences like moisture, dust and wide temperature range are challenging, so are the mechanical aspects. Power electronic suffers from the vibrations inside the trains in addition to the electric and thermal load. The mission profile of trams and subway trains consist of a high number of acceleration and deceleration cycles, repeated day by day. This mode of operation leads to extreme demands regarding power- and thermal-cycling capability.

To suit the special needs of this application, Infineon provides high-power IGBT module, especially dedicated to transportation and similar applications. IGBT-Modules in voltage classes 3.3kV, 4.5kV and 6.5kV with enhanced mechanical and thermal features are installed in trains all over the world to allow reliable, safe and cost-efficient operation. The new XHP™3 housing platform for high power IGBT provides higher flexibility and reliability while assuring optimal integration into customers systems whereas the new RCDC IGBT technology provides high power density, higher efficiency, long lifecycle, reliability, improved temperature behaviour and reduced system costs.

Modern wind turbines demand sustainable power generation under grid requirements and high power density. Reliability and robustness should ensure minimum maintenance to allow usage expectation of 25 years. Infineon also offers a complete application portfolio for wind system design. The PrimePACK IGBT with .XT technology family comprises solutions for a power range of up to several megawatts, extending lifetime for the whole system. In addition, thermal management and resistance can be optimized with a Thermal Interface Material (TIM). EconoPACK + D-series FS500R17OE4D with a stronger freewheeling diode also offers a host of benefits for wind applications.

A broad range of Power Block modules which are designed and assembled in pressure contact technology for highest reliability will be shown. The modules contains thyristor and diode pellets in a voltage range of 1600 V to 4400 V and a current range of 60 A up to 1100 A.

In the automotive space, the company will show a system solution for an automotive main inverter able to drive (H)EV vehicles, and EiceDRIVER gate drivers with integrated functions adding system value, as well as the latest IGBT modules raising efficiency and mileage: HybridPACK Drive sets a new benchmark in the market.

For more information visit www.infineon.com

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