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Infineon invests €1.6 billion in new Austrian 300-millimeter chip factory

Infineon Technologies intends to build a new factory for power semiconductors, a fully automated chip factory for manufacturing 300-millimeter thin wafers, at their Villach location in Austria. The facility will stand next to the existing production facility. Austria’s Chancellor Sebastian Kurz, Dr. Reinhard Ploss, Chief Executive Officer of Infineon, and Dr. Sabine Herlitschka, Chief Executive Officer of Infineon Austria, presented the project in Vienna. Investments totaling around €1.6 billion are planned over six years. Some 400 new jobs, especially highly qualified ones, will be created by the new, highly efficient factory. Construction is scheduled to start in the first half of 2019 and production is expected to commence at the start of 2021. The additional sales potential of the new factory, given full capacity utilization, is put at around €1.8 billion a year.

Villach is the group’s competence center for power semiconductors, and has long been an important site for innovation in Infineon’s production network. Manufacturing of power semiconductors on 300-millimeter thin wafers was developed here and then expanded into fully automated high-volume production at the Dresden location over the past years. Thanks to the larger diameter of the wafers, this technology delivers significant gains in productivity and reduces working capital. Dresden is Infineon’s largest site for wafer processing (frontend) and 300-millimeter production capacities there are expected to be fully utilized by 2021. Infineon will apply the automation and digitization concepts from Dresden at the new Villach factory and develop them together with the two locations in order to increase productivity and ensure synergies in relation to systems and processes at both.

According to market researchers from IHS Markit, Infineon is the world’s largest provider of power semiconductors with a market share of 18.5 percent.

For more information visit www.infineon.com

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