Power Integrations’ latest gate driver ICs tout improved creepage and clearance

In this video, Mike Hornkamp of Power Integrations talks to Alix Paultre of EETimes and Power Electronics News at the SPS-IPC 2017 show about Power Integrations’ new gate driver ICs. These new devices use new packaging and topology to improve creepage and clearance. One example addressed reduced losses in IGBTs, and the advantages in drivetrain systems.

For more information visit www.power.com.

Components & Devices News

Related Posts

No Comments

Join the conversation!

Error! Please fill all fields.