3D Power Electronics Integration and Manufacturing Symposium charts the future of integrative packaging technologies

The Power Sources Manufacturers Association (PSMA) announced that the second biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-18) will be held June 25-27, 2018, on the campus of the University of Maryland. Following on the success of the inaugural event in 2016, 3D-PEIM-18 brings together a group of world-class experts representing a range of disciplinary perspectives to advance development of future 3D power electronics systems.

The symposium encompasses additive, embedded, co-designed and integrative packaging technologies. Sessions will address mechanical, materials, reliability and manufacturability issues in deploying small, smart power-dense components and modules. The 3D-PEIM-18 symposium is underwritten by the PSMA as part of its ongoing commitment to educate and inform the power electronics industry. Other supporting organizations include: CALCE/University of Maryland, Virginia Tech, North Carolina State University, and the IEEE Electronics Packaging Society.

In addition to the technical sessions and tutorials, the symposium will also feature table-top exhibits during the breaks, lunch periods and evening networking sessions. On the last day of the symposium, attendees are invited on a guided tour of the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland.

For more information visit www.3D-PEIM.org

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