The Power Sources Manufacturers Association (PSMA) announced that the second biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-18) will be held June 25-27, 2018, on the campus of the University of Maryland. Following on the success of the inaugural event in 2016, 3D-PEIM-18 brings together a group of world-class experts representing a range of disciplinary perspectives to advance development of future 3D power electronics systems.
The symposium encompasses additive, embedded, co-designed and integrative packaging technologies. Sessions will address mechanical, materials, reliability and manufacturability issues in deploying small, smart power-dense components and modules.
The 3D-PEIM-18 symposium is underwritten by the PSMA as part of its ongoing commitment to educate and inform the power electronics industry. Other supporting organizations include: CALCE/University of Maryland, Virginia Tech, North Carolina State University, and the IEEE Electronics Packaging Society.
In addition to the technical sessions and tutorials, the symposium will also feature table-top exhibits during the breaks, lunch periods and evening networking sessions. On the last day of the symposium, attendees are invited on a guided tour of the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland.
For more information visit www.3d-peim.org