Direct Bonded Copper (DBC) and Active Metal Brazed (AMB) ceramic substrates are the most popular substrates for the assembly and packaging of IGBT and MOSFET bare dies in power modules. As a designer of power modules, you will have to select the right substrate for your application. In this webinar, you will learn how the ceramic grade, the ceramic thickness and copper thickness are influencing the isolation voltage, output power and reliability of your module. In only 3 steps, you will be able to find the best trade-off between the main characteristics of DBC / AMB substrates to fulfill the requirements of your application.
- June 01st, 2017
- 3 pm CEST (Berlin time) / 9 am EDT (New York time)