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Thermal Management

AVX to present its latest solutions at APEC 2018

AVX is presenting and exhibiting at the 2018 Applied Power Electronics Conference (APEC), which will take place at the Henry B. Gonzalez Convention Center in San Antonio, Texas, March 4–8. AVX Fellow, Ron Demcko, and Supercapacitor Product Marketing Engineer, Eric DeRose, will ...

Components & Devices Power Supplies & Energy Storage Thermal Management News

Infineon highlights power electronics portfolio at APEC 2018

Power semiconductor technologies based on advanced GaN, SiC and Si will share the spotlight in the Infineon Technologies exhibit at the Applied Power Electronics Conference (APEC). From March 4-8, 2018, Infineon will showcase energy-efficient, reliable and cost-effective semicond...

Components & Devices Power Supplies & Energy Storage Thermal Management News

PSMA’s Safety & Compliance Committee to host APEC industry sessions

The Power Sources Manufacturers Association (PSMA) Safety & Compliance Technical Committee is sponsoring two Industry Sessions as part of APEC 2018. The sessions are: “Comparisons and Trade-offs of Integrated Gate Driver Isolation Technologies” (IS04) and “Isolation Top...

Components & Devices Test & Measurement Thermal Management News

BRIDG collaboration to create battery-free IoT wireless sensors

BRIDG, an industry-led public-private partnership for advanced technologies and manufacturing processes, announced a collaboration with Face International in the development and integration of a patented energy-harvesting technology – the Evercell power cell – that is capable...

Components & Devices Power Supplies & Energy Storage Thermal Management News

Sensata’s solid-state relay with integrated thermostat protects electronic systems

When it comes to electronic switching in load-control applications, solid-state relays (SSRs) deliver the speed and reliability required. SSRs have no moving parts to affect wear or accuracy, enabling not only predictable operation, but also significantly longer operational life...

Components & Devices Thermal Management News

X-in-Board tech embeds special inlays in standard PCBs

In many designs often only require high-performance (and more expensive) technologies in small areas of their PCB. AT&S' X-in-Board enables a combination of different technologies and materials within any common PCB, such as a standard FR4 board or multi-layers with vias (con...

Thermal Management News

TT Electronics claims lightest, most effective PCB-mounted heatsink for power resistors

TT Electronics, a leader in engineered electronics for performance critical applications, announced the WMHP-HS heatsink, specifically designed to optimize the thermal performance of its WMHP series power resistors. Providing a combination of high surface area, superior cooling p...

Thermal Management News

SEPA’s latest energy-saving EC fan family has UL approval

SEPA EUROPE has extended its portfolio to include electronically commutated fans. Thanks to the combination of DC fans with a fully integrated AC/DC converter, AC fans can now be operated at speeds that are independent of power frequency Up to 4500 rpm can be realized and the ...

Thermal Management News

Kyma unveils high-quality 200-mm GaN on QST templates

Kyma Technologies, a leading developer of advanced wide-bandgap semiconductor materials technologies, announced it has used its new K200 hydride vapor phase epitaxy (HVPE) growth tool to produce high quality 200-mm diameter HVPE GaN on QST (QROMIS Substrate Technology) templates...

Components & Devices Thermal Management News

Harwin metal backshells have built-in shielding to ensure electrical & mechanical integrity

To complement its widely-used Datamate wire-to-board connector offering, hi-rel connector manufacturer Harwin now supplies a comprehensive range of backshells with a rugged aluminium alloy construction and electroless nickel plating. Through these accessories, which can be applie...

Components & Devices Thermal Management News

AT&S enables “cool” miniaturized high-power designs

Miniaturization and increasing power densities are major concerns for modern electronic applications. The lifetime of electronic applications can be dramatically reduced by the increase of the working temperatures by just a few degrees. Thermal solutions such as modern miniaturiz...

Thermal Management News

Panasonic’s soft-PGS thermal management material now at RS Components

RS Components has introduced a new range of soft-PGS (Pyrolytic Graphite Sheet) thermal interface material from Panasonic. The material provides excellent thermal protection in an easy-to-use format that makes it ideal for delivering thermal management and heat-sinking in applic...

Thermal Management News

Bourns adds high-temperature PPTC resettable fuses to its Multifuse line

Bourns, a leader in electronic components, announced it has added new AEC-Q200 certified high-temperature Polymer Positive Temperature Coefficient (PPTC) resettable fuses to its line of Multifuse products. Provided in 1206 and 1210 (3014 and 3024 metric) surface mount packages...

Components & Devices Thermal Management News

The Weekly Watt

This has been a slow news week because everyone knew the Americans were on holiday, but there have been a few interesting pieces of news coming across the wires. The biggest news for us involved some important staff changes; Paul O’Shea, the current editor of Power Electronic N...

Components & Devices Power Supplies & Energy Storage Thermal Management News

First halogen-free multi-layer board material for RF power amplifiers suits wireless base stations

Panasonic Corporation announced that it has commercialized its "High Thermal Conductivity, Low Transmission Loss Halogen-free Multi-layer Circuit Board Material (Part No. R-5575)" intended for wireless base stations, and will launch mass production in August 2017. The industry's ...

Thermal Management News

Desktop temp controller features internal power supply and full H bridge

The Temperature Controller Model 5R6-900 suits laboratories and all temperature cycling applications. The device comes packaged with an onboard power supply, computer hookup and controller operating system. Temperature cycling or thermal cycling is a phrase applied all through...

Thermal Management News

UL-approved thermistor features energy ratings to 40 J in 13-mm dia

Ametherm announces a circuit protection thermistor in a 13-mm diameter that is UL-approved with a maximum continuous current rating of 6.0 A and energy rating of 40 J. Previously, designers had to rely on devices with larger diameters from 15.0 to 25.0 mm to achieve the high curr...

Thermal Management News

Rogers Corporation to showcase curamik cooling solutions at Laser World of Photonics Show

Rogers Corporation’s Power Electronics Solutions (PES) group will be showcasing its curamik cooling solutions at the upcoming Laser World of Photonics Fair to be held June 26-29 at Messe München. The bi-annual Laser World of Photonics is the only trade fair that combines ph...

Thermal Management News

Aluminum heat sinks compatible with several transistor packages

CUI’s Thermal Management Group added a heat sink product line to its existing portfolio of Peltier devices and dc fans. The new line of aluminum heat sinks, available in both extruded and stamped versions, are compatible with TO‑218, TO‑220, TO‑252, and TO‑263 transisto...

Thermal Management News

Thermal management for semiconductor metrology equipment

Today, automated metrology systems are implemented throughout the thin film semiconductor manufacturing process. Since many of the properties of a thin film are also temperature dependent, temperature stability is key and thermal management is critical. In addition temperature co...

Thermal Management News